Enhanced material properties and optimized resonatorbetter FOM (k2 * Q) enables differentiated filter performance at frequencies in range 1 to 7GHz for mobile, Wi-Fi, 5G infrastructure and defense applications.
High purity AlN piezoelectric offers high acoustic velocity & thermal conductivity resulting in improved power handling for RF filters for Wi-Fi, 5G infrastructure & mobile applications
Higher k2 (coupling) enables wider bandwidth filters for Wi-Fi, 5G infrastructure & mobile, and defense applications.
MEMS-based process flow on a 6” Si-substrate with a unique wafer process and flexible with respect to piezo material synthesis/composition. This process is compatible with chip, wire-bond, wafer-level packaging (WLP) and allows design-of-experiments (DOE) to explore piezo quality influence on RF filter performance.
XBAW® technology is compatible with multiple packaging technologies to enable compact footprint and compliance to standard manufacturing processes as required for low cost manufacturing especially 5G mobile, massive MIMO and small cell applications.